Application：
● Underfilling，FPC encapsulation
● CCD Camera module encapsulation
● SMA
● Silver Epoxy
● Encapsulation
● SMD
● Precision coating
● Mobile phone frame point hot melt adhesive
● Chips Package
● Widely used in semiconduct,electronics manufacture,medicine,biochemistry,automobile,LED,etc.
Product Specification：
| XYZ System | ||
| Dispense Area | 300 X 400mm(Max) | |
| （XY）/ XY Repeatability | ±5μm | |
| Z Repeatability | ±20μm | |
| XY Acceleration | can reach 1.5G | |
| XY Velocity | can reach 1.2m/s | |
| Conveyor System | ||
| Conveyor | 880-920mm(adjustable) | |
| Subtrate Size(L,W) | 55x55mm(Min)，400x400mm(Max) | |
| Heater | Hot Air Heater，Contact Heater | |
| Feed Track Load-Bearing | ≤1.5KG(≤6KG option) | |
| Vision system | ||
| Camera | 1.3megapixel，90fpsSoftware supports Moving Pattern Recognition(Optional) | |
| Lighting | RGBW 4 colors | |
| Facilities | ||
| Machine Dimension(L,W,H) | 738x1150x1880mm | |
| Air Pressure | 80-90 PSI | |
| Power Input | 220VAC，44-64 HZ Single phase，63A | |
| Ventilation | orifice diameter 148mm(Top) | |
| Total Weight | 1180KG | |
| Product Code | D3350 | |
| Height Sensing System | Contactless Laser Sensor(Accuracy: ±20μm)Software supports Moving High Sensing(Optional) | |
| Min Fluid Weight | <0.01mg | |
| Vision System | Industrial Camera | |
| Software | Windows7 operating systerm | |
